JPS645895Y2 - - Google Patents

Info

Publication number
JPS645895Y2
JPS645895Y2 JP1983203897U JP20389783U JPS645895Y2 JP S645895 Y2 JPS645895 Y2 JP S645895Y2 JP 1983203897 U JP1983203897 U JP 1983203897U JP 20389783 U JP20389783 U JP 20389783U JP S645895 Y2 JPS645895 Y2 JP S645895Y2
Authority
JP
Japan
Prior art keywords
heat sink
integrated circuit
hybrid integrated
recess
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1983203897U
Other languages
English (en)
Japanese (ja)
Other versions
JPS60109332U (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1983203897U priority Critical patent/JPS60109332U/ja
Publication of JPS60109332U publication Critical patent/JPS60109332U/ja
Application granted granted Critical
Publication of JPS645895Y2 publication Critical patent/JPS645895Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP1983203897U 1983-12-27 1983-12-27 混成集積回路装置 Granted JPS60109332U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1983203897U JPS60109332U (ja) 1983-12-27 1983-12-27 混成集積回路装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1983203897U JPS60109332U (ja) 1983-12-27 1983-12-27 混成集積回路装置

Publications (2)

Publication Number Publication Date
JPS60109332U JPS60109332U (ja) 1985-07-25
JPS645895Y2 true JPS645895Y2 (en]) 1989-02-14

Family

ID=30766301

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1983203897U Granted JPS60109332U (ja) 1983-12-27 1983-12-27 混成集積回路装置

Country Status (1)

Country Link
JP (1) JPS60109332U (en])

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11264299B1 (en) * 2020-09-03 2022-03-01 Northrop Grumman Systems Corporation Direct write, high conductivity MMIC attach

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5730316B2 (en]) * 1973-03-23 1982-06-28
JPS587645Y2 (ja) * 1976-03-23 1983-02-10 日本電気ホームエレクトロニクス株式会社 半導体装置
JPS58173855A (ja) * 1982-04-02 1983-10-12 Mitsubishi Electric Corp 半導体素子用冷却装置

Also Published As

Publication number Publication date
JPS60109332U (ja) 1985-07-25

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